An assembly for providing electromagnetic interference (EMI) shielding and for dissipating heat from electronic components. The assembly including: a metallic frame including a wall extending upwardly from a circuit board; an EMI shield having a top with holes and having sidewalls that surround the top, extend downwardly, and are attachable to the wall of the frame in a first latched position and in a second, un-latched position; a layer of thermally-conductive, viscous heat sink grease on the top of the EMI shield and filling holes in the top of the EMI shield, heat sink grease in the holes being in direct physical contact with the top surface of the at least one electronic component when the EMI shield is in the second, un-latched position; and a heat sink on top of and in direct physical contact with the heat sink grease on top of the EMI shield.