Invention Grant
- Patent Title: Printed circuit board with a differential line pair having vias in each line that are not equally spaced apart
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Application No.: US14921170Application Date: 2015-10-23
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Publication No.: US09854666B2Publication Date: 2017-12-26
- Inventor: Yu-Hsu Lin
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201510648809 20151009
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A printed circuit board includes a differential pair of transmission lines. The differential pair of transmission lines includes a first signal transmission line and a second signal transmission line. The first signal transmission line includes a first via and a second via. The second transmission line includes a third via and a fourth via. A first distance between a center of the first via and a center of the third via is equal to a first value. A second distance between a center of the second via and a center of the fourth via is equal to the first value. A third distance between the center of the first via and the center of the second via is equal to a second value. A fourth distance between the center of the third via and the center of the fourth via is not equal to the second value.
Public/Granted literature
- US20170105281A1 PRINTED CIRCUIT BOARD Public/Granted day:2017-04-13
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