Invention Grant
- Patent Title: Electronic device including cable supporting structure
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Application No.: US15366595Application Date: 2016-12-01
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Publication No.: US09854678B2Publication Date: 2017-12-26
- Inventor: Byoung-ryoul Song , Eui-suck Sung
- Applicant: Samsung Electronics Co., Ltd. , POCONS CO., LTD.
- Applicant Address: KR KR
- Assignee: Samsung Electronics Co., Ltd,Pocons Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd,Pocons Co., Ltd
- Current Assignee Address: KR KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2015-0173304 20151207
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H05K3/32 ; H05K9/00 ; H01R4/48 ; H01R13/6594 ; H05K1/02 ; H05K3/40

Abstract:
An electronic device is provided which includes a printed circuit board (PCB) including a non-conductive layer that forms at least a portion of a first surface, and a conductive layer arranged between the first surface and a second surface, an electronic component arranged on a first area of the first surface of the PCB, a conductive shield structure arranged on the PCB to cover the first area and the electronic component on the PCB, a support structure connected to the PCB and including a first part that faces a portion of one side of the conductive shield structure, and a cable extending along the one side of the conductive shield structure, inserted between the support structure and the portion of the one side of the conductive shield structure, and including at least one conductive line and an insulation layer that covers the at least one conductive line.
Public/Granted literature
- US20170164498A1 ELECTRONIC DEVICE INCLUDING CABLE SUPPORTING STRUCTURE Public/Granted day:2017-06-08
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