Invention Grant
- Patent Title: Multilayer substrate
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Application No.: US15214680Application Date: 2016-07-20
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Publication No.: US09854680B2Publication Date: 2017-12-26
- Inventor: Yoshihito Otsubo
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2014-081123 20140410
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/46

Abstract:
A multilayer substrate comprises: a stack having a plurality of insulating base materials; a first component arranged within the stack at a first level in a thickness direction of the stack; a second component arranged within the stack at a second level different from the first level and arranged so that, in a plan view, at least a portion of the second component overlaps with a portion of the first component; and a supplementary member arranged to at least partly exist in a range, in a thickness direction, as high as or higher than a lower end of the second component and as high as or lower than an upper end of the second component, and in a plan view, within a region of a projected area of the first component not overlapped with the second component, the supplementary member having a rigidness higher than the insulating base materials.
Public/Granted literature
- US20160330844A1 MULTILAYER SUBSTRATE Public/Granted day:2016-11-10
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