Invention Grant
- Patent Title: Electronic component, method for manufacturing the electronic component, and circuit board
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Application No.: US14838562Application Date: 2015-08-28
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Publication No.: US09854685B2Publication Date: 2017-12-26
- Inventor: Nobuo Ikemoto , Makoto Osamura , Satoshi Sasaki , Yuki Wakabayashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-093506 20130426
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K3/30 ; H01L27/146 ; H05K1/18 ; H05K3/46 ; H04N5/225 ; H05K1/02 ; H05K1/11 ; H05K3/32 ; H01L23/00 ; H05K3/40
Abstract:
A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.
Public/Granted literature
- US20150373854A1 ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, AND CIRCUIT BOARD Public/Granted day:2015-12-24
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