A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.