Invention Grant
- Patent Title: Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
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Application No.: US15363886Application Date: 2016-11-29
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Publication No.: US09855008B2Publication Date: 2018-01-02
- Inventor: Jacob Markham , Ulrich Hausch
- Applicant: Heraeus Deutschland GmbH & Co. KG
- Applicant Address: DE Hanau
- Assignee: Heraeus Deutschland GmbH & Co. LG
- Current Assignee: Heraeus Deutschland GmbH & Co. LG
- Current Assignee Address: DE Hanau
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: A61N5/00
- IPC: A61N5/00 ; A61B5/00 ; A61N1/375 ; B23K20/00 ; B23K20/10 ; B23K1/00 ; B23K20/16 ; B23K20/233 ; A61N1/36 ; B23K101/42 ; B23K101/36 ; B23K103/14

Abstract:
One aspect is an implantable medical device including a metal housing configured for implantation in a human and including a biocompatible metal and defining an opening. A feedthrough device is configured within the opening of the metal housing and includes an insulating section and a conducting section, the insulating section electrically isolating the conducting section from the metal housing. An ultrasonic joint is configured between the feedthrough device and metal housing that hermetically and mechanically bonds the feedthrough device and metal housing. The biocompatible metal of the housing is a microstructure primarily having α-phase grains.
Public/Granted literature
- US20170071542A1 DIRECT INTEGRATION OF FEEDTHROUGH TO IMPLANTABLE MEDICAL DEVICE HOUSING WITH ULTRASONIC WELDING Public/Granted day:2017-03-16
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