- Patent Title: Gas injector and cover plate assembly for semiconductor equipment
-
Application No.: US15145995Application Date: 2016-05-04
-
Publication No.: US09855575B2Publication Date: 2018-01-02
- Inventor: Tsan-Hua Huang , Tsung-Hsun Han , Paul Wong , Miao-Chan Wu
- Applicant: HERMES-EPITEK CORPORATION
- Applicant Address: TW Taipei
- Assignee: HERMES-EPITEK CORPORATION
- Current Assignee: HERMES-EPITEK CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Huffman Law Group, PC
- Priority: TW102106341A 20130223
- Main IPC: B05B1/24
- IPC: B05B1/24 ; B05B15/02 ; C23C16/44 ; C23C16/455

Abstract:
The invention provides a gas injector and cover plate assembly comprising a cover plate, a gas injector and a ceiling. The cover plate comprises a plurality of cooling fluid channels. The gas injector is configured to be located on the cover plate comprising a gas distributor, a fluid-cooling gas transmitter, a plurality of gas spraying plates and a conducting cone. The gas distributor distributes a plurality of gases and a gas transmitter cooling fluid. The gas distributor comprises a gas conduit for introducing a first gas. The fluid-cooling gas transmitter connects the gas distributor to introduce the gas transmitter cooling fluid to form a plurality of cooling fluid walls and the first gas and the gases. The gas spraying plates and the conducting cone are located beneath the fluid-cooling gas transmitter.
Public/Granted literature
- US20160244876A1 GAS INJECTOR AND COVER PLATE ASSEMBLY FOR SEMICONDUCTOR EQUIPMENT Public/Granted day:2016-08-25
Information query