Invention Grant
- Patent Title: Heat sink, method for making the same, and electronic device having the same
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Application No.: US14834673Application Date: 2015-08-25
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Publication No.: US09855629B2Publication Date: 2018-01-02
- Inventor: Yu-Cheng Huang
- Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
- Applicant Address: CN Qinhuangdao TW Tayuan, Taoyuan
- Assignee: Qi Ding Technology Qinhuangdao Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee: Qi Ding Technology Qinhuangdao Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Qinhuangdao TW Tayuan, Taoyuan
- Agency: ScienBiziP, P.C.
- Priority: CN201510351996 20150624
- Main IPC: B23P15/26
- IPC: B23P15/26 ; H01L23/427 ; H01L21/48
Abstract:
A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity.
Public/Granted literature
- US20160381833A1 HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2016-12-29
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