Invention Grant
- Patent Title: Method of forming aligned pattern in pattern formation region by using imprint process
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Application No.: US14724898Application Date: 2015-05-29
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Publication No.: US09855703B2Publication Date: 2018-01-02
- Inventor: Sunghoon Lee , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jaeseung Chung , Sukgyu Hahm , Jong G. Ok , Ilsun Yoon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cantor Colburn LLP
- Priority: KR10-2014-0095014 20140725
- Main IPC: B29C59/16
- IPC: B29C59/16 ; B29C67/00 ; G03F7/00 ; B29C45/00

Abstract:
A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.
Public/Granted literature
- US20160023399A1 METHOD OF FORMING ALIGNED PATTERN IN PATTERN FORMATION REGION BY USING IMPRINT PROCESS Public/Granted day:2016-01-28
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