Invention Grant
- Patent Title: Resin-based panel with encapsulated high-resolution image layer and methods of making same
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Application No.: US14070182Application Date: 2013-11-01
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Publication No.: US09855731B2Publication Date: 2018-01-02
- Inventor: Matthew T. Sutton , John E. C. Willham
- Applicant: 3Form, LLC
- Applicant Address: US UT Salt Lake City
- Assignee: 3FORM, LLC
- Current Assignee: 3FORM, LLC
- Current Assignee Address: US UT Salt Lake City
- Agency: Workman Nydegger
- Main IPC: B32B37/06
- IPC: B32B37/06 ; B32B27/08 ; B32B7/12 ; B32B27/30 ; B32B27/36 ; B32B27/40 ; B32B27/18 ; B32B37/18 ; B32B37/10 ; B32B37/12
Abstract:
Implementations of the present invention relate to systems, methods, and apparatus for manufacturing aesthetically pleasing, decorative architectural resin panels having high-resolution image layers. In particular, at least one implementation includes a laminated resin panel having a decorative image layer formed from layered or cross-linked ink free from cracks, splits, or other deformation. Additional implementations relate to curved or otherwise non-planar decorative architectural resin panels having high-resolution image layers.
Public/Granted literature
- US20140220317A1 RESIN-BASED PANEL WITH ENCAPSULATED HIGH-RESOLUTION IMAGE LAYER AND METHODS OF MAKING SAME Public/Granted day:2014-08-07
Information query
