Invention Grant
- Patent Title: Piezoelectric printhead assembly
-
Application No.: US15307208Application Date: 2014-04-30
-
Publication No.: US09855746B2Publication Date: 2018-01-02
- Inventor: Peter J Fricke , Andrew L Van Brocklin , Scott A Linn
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2014/035998 WO 20140430
- International Announcement: WO2015/167483 WO 20151105
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/155 ; B41J2/045
Abstract:
A piezoelectric printhead assembly can include a micro-electro mechanical system (MEMS) die including a plurality of nozzles and a first application-specific integrated circuit (ASIC) die coupled to the MEMS die by a first plurality of wire bonds.
Public/Granted literature
- US20170043584A1 PIEZOELECTRIC PRINTHEAD ASSEMBLY Public/Granted day:2017-02-16
Information query
IPC分类:
