An electronic device includes: a substrate; a piezoresistive element which is disposed on the side of the surface on one side of the substrate; a wall section which is disposed to surround the piezoresistive element in a plan view of the substrate, on the side of the surface on one side of the substrate; via wiring which is disposed on the side of the surface on one side of the substrate; and a covering layer which is disposed away from the via wiring in the plan view on the side opposite to the substrate with respect to the wall section and configures a cavity portion along with the substrate and the wall section.