- Patent Title: Aromatic polyamide films for solvent resistant flexible substrates
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Application No.: US13528047Application Date: 2012-06-20
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Publication No.: US09856376B2Publication Date: 2018-01-02
- Inventor: Limin Sun , Dong Zhang , Frank W. Harris , Jiaokai Jing
- Applicant: Limin Sun , Dong Zhang , Frank W. Harris , Jiaokai Jing
- Applicant Address: US OH Akron
- Assignee: Akron Polymer Systems, Inc.
- Current Assignee: Akron Polymer Systems, Inc.
- Current Assignee Address: US OH Akron
- Agency: Benesch, Friedlander, Coplan & Aronoff LLP
- Main IPC: C08L77/10
- IPC: C08L77/10 ; C08J5/18 ; C08G69/32

Abstract:
Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures >300° C. The films are crosslinked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.
Public/Granted literature
- US20130011642A1 AROMATIC POLYAMIDE FILMS FOR SOLVENT RESISTANT FLEXIBLE SUBSTRATES Public/Granted day:2013-01-10
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