Invention Grant
- Patent Title: Clamp apparatus, substrate carry-in/out apparatus using the same, and substrate processing apparatus
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Application No.: US15070123Application Date: 2016-03-15
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Publication No.: US09857124B2Publication Date: 2018-01-02
- Inventor: Mitsuru Obara , Hisashi Inoue , Keishi Shionaga , Masahiro Kobayashi , Norio Baba , Hiroshi Kikuchi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2015-058160 20150320
- Main IPC: F26B5/04
- IPC: F26B5/04 ; F27B5/04 ; H01L21/673 ; H01L21/677 ; H01L21/67 ; F16B2/02 ; F27B17/00 ; F27D3/00

Abstract:
The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.
Public/Granted literature
- US20160273836A1 CLAMP APPARATUS, SUBSTRATE CARRY-IN/OUT APPARATUS USING THE SAME, AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2016-09-22
Information query
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