Invention Grant
- Patent Title: Collapsible hinge assembly
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Application No.: US15112505Application Date: 2014-03-28
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Publication No.: US09857847B2Publication Date: 2018-01-02
- Inventor: Hui-Leng Lim , Chan-Woo Park , Hui He
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc Patent Department
- International Application: PCT/US2014/032100 WO 20140328
- International Announcement: WO2015/147845 WO 20151001
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
Implementations of the present disclosure disclose a collapsible hinge assembly for a portable electronic device. According to one implementation, a base member including a hinge side is connected to a carbon fiber sheet at a first end. The carbon fiber sheet includes a collapsible region. Moreover, a display device is connected to the carbon fiber sheet along a front surface thereof.
Public/Granted literature
- US20170115703A1 Collapsible Hinge Assembly Public/Granted day:2017-04-27
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