In one embodiment a transparent conductive component is described comprising a flexible transparent substrate; a transparent conductive layer disposed on the flexible transparent substrate; and a plurality of metal traces disposed on and in electrical communication with the transparent conductive layer. A portion of the flexible transparent substrate comprising the transparent conductive layer and metal traces forms an interconnect circuit tab. At least the interconnect circuit tab comprises a cured organic polymeric material disposed on the (e.g. patterned) transparent conductive layer and metal traces metal traces and flexible transparent substrate such that the cured organic polymeric material forms an exposed surface layer. The cured organic polymeric material is optionally disposed at the bezel region and/or at a central region of the transparent conductive component (e.g. touch sensor).