Invention Grant
- Patent Title: Transducer support, ultrasound probe, and ultrasound imaging apparatus
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Application No.: US14511511Application Date: 2014-10-10
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Publication No.: US09858911B2Publication Date: 2018-01-02
- Inventor: Chang Yeon Won , Hyun Phill Ko , Sung Ki Kim , Jeong Mln Na , Jae Moon Jo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2014-0001250 20140106
- Main IPC: G10K11/00
- IPC: G10K11/00 ; G10K11/18 ; G01S15/02 ; G01S7/52 ; G01S15/89 ; B06B1/06 ; A61B8/00

Abstract:
The present disclosure provides a transducer support, ultrasound probe, and ultrasound imaging apparatus. The ultrasound transducer support includes a first layer having first areas in which heat transfer materials are arranged and second areas in which sound absorbent materials are arranged, the first and second areas being arranged alternately; and a second layer having third areas located below the first areas in which sound absorbent materials are arranged and fourth areas located below the second areas in which heat transfer materials are arranged.
Public/Granted literature
- US20150194143A1 TRANSDUCER SUPPORT, ULTRASOUND PROBE, AND ULTRASOUND IMAGING APPARATUS Public/Granted day:2015-07-09
Information query