Invention Grant
- Patent Title: Packaging for high-power microwave module
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Application No.: US14876886Application Date: 2015-10-07
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Publication No.: US09859178B2Publication Date: 2018-01-02
- Inventor: Yannick C. Morel , Sheila J. Konecke , Santos Nazario-Camacho , Clint J. Novotny , Keith K. Sturcken
- Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Russell Ng PLLC
- Agent Antony P. Ng; Scott J. Asmus
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H01L23/04 ; H01L23/10 ; H01L21/50

Abstract:
A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module.
Public/Granted literature
- US20160100495A1 PACKAGING FOR HIGH-POWER MICROWAVE MODULE Public/Granted day:2016-04-07
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