Invention Grant
- Patent Title: Heat sink for a semiconductor chip device
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Application No.: US15370307Application Date: 2016-12-06
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Publication No.: US09859186B2Publication Date: 2018-01-02
- Inventor: Nathan A. Nuttall
- Applicant: Coriant Advanced Technology, LLC
- Applicant Address: US NY New York
- Assignee: Elenion Technologies, LLC
- Current Assignee: Elenion Technologies, LLC
- Current Assignee Address: US NY New York
- Agency: Nixon Peabody LLP
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/552 ; G02B6/42 ; H01L23/48 ; H01L25/16 ; H01L23/373
Abstract:
A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.
Public/Granted literature
- US20170103934A1 HEAT SINK FOR A SEMICONDUCTOR CHIP DEVICE Public/Granted day:2017-04-13
Information query
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