Invention Grant
- Patent Title: Electronic device with periphery contact pads surrounding central contact pads
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Application No.: US15251127Application Date: 2016-08-30
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Publication No.: US09859196B2Publication Date: 2018-01-02
- Inventor: Jing-En Luan
- Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Applicant Address: CN Shenzhen
- Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
- Current Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Priority: CN201310629973 20131129; CN201320783051U 20131129
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/48 ; H01L23/433 ; H01L23/367 ; H01L23/498 ; H01L21/768 ; H01L23/482 ; H01L23/28 ; H01L23/31 ; H01L21/56
Abstract:
An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.
Public/Granted literature
- US20160372406A1 Electronic Device with First and Second Contact Pads and Related Methods Public/Granted day:2016-12-22
Information query
IPC分类:
