Invention Grant
- Patent Title: Integrated circuit package fabrication
-
Application No.: US14691660Application Date: 2015-04-21
-
Publication No.: US09859197B2Publication Date: 2018-01-02
- Inventor: Lee Han Meng@ Eugene Lee , Sueann Lim Wei Fen , Sarel Bin Ismail
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L23/00 ; H01L23/532 ; H01L23/544 ; H01L23/31 ; H01L21/56 ; H01L21/48

Abstract:
A method of making an integrated circuit (“IC”) device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame.
Public/Granted literature
- US20150228581A1 INTEGRATED CIRCUIT PACKAGE FABRICATION Public/Granted day:2015-08-13
Information query
IPC分类: