Invention Grant
- Patent Title: FinFET structure and method for manufacturing thereof
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Application No.: US15358953Application Date: 2016-11-22
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Publication No.: US09859404B2Publication Date: 2018-01-02
- Inventor: Chun Hsiung Tsai , Chun-Lung Ni , Kei-Wei Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L27/092 ; H01L29/78 ; H01L29/10 ; H01L21/225 ; H01L21/02 ; H01L21/311 ; H01L21/8238 ; H01L21/324

Abstract:
Present disclosure provides a FinFET structure, including a plurality of fins, a gate, and a first dopant layer. The gate is disposed substantially orthogonal over the plurality of fins, covering a portion of a top surface and a portion of sidewalls of the plurality of fins. The first dopant layer covers the top surface and the sidewalls of a junction portion of a first fin, configured to provide dopants of a first conductive type to the junction portion of the first fin. The junction portion is adjacent to the gate.
Public/Granted literature
- US20170077269A1 FINFET STRUCTURE AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2017-03-16
Information query
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