Invention Grant
- Patent Title: Field effect transistor with elevated active regions and methods of manufacturing the same
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Application No.: US14723868Application Date: 2015-05-28
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Publication No.: US09859422B2Publication Date: 2018-01-02
- Inventor: Masatoshi Nishikawa , Akira Inoue , Fumiaki Toyama
- Applicant: SANDISK TECHNOLOGIES, INC.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/417 ; H01L29/66 ; H01L29/08 ; H01L27/112 ; H01L21/8234 ; H01L21/265 ; H01L21/8238 ; H01L27/11529 ; H01L27/11556 ; H01L27/11573 ; H01L27/11582

Abstract:
A field effect transistor having a higher breakdown voltage can be provided by forming a contiguous dielectric material layer over gate stacks, forming via cavities laterally spaced from the gate stacks, selectively depositing a single crystalline semiconductor material, and converting upper portions of the deposited single crystalline semiconductor material into elevated source/drain regions. Lower portions of the selectively deposited single crystalline semiconductor material in the via cavities can have a doping of a lesser concentration, thereby effectively increasing the distance between two steep junctions at edges of a source region and a drain region. Optionally, embedded active regions for additional devices can be formed prior to formation of the contiguous dielectric material layer. Raised active regions contacting a top surface of a substrate can be formed simultaneously with formation of the elevated active regions that are vertically spaced from the top surface.
Public/Granted literature
- US20160351709A1 FIELD EFFECT TRANSISTOR WITH ELEVATED ACTIVE REGIONS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2016-12-01
Information query
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