Invention Grant
- Patent Title: Addition curable organopolysiloxane composition, and semiconductor package
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Application No.: US15235751Application Date: 2016-08-12
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Publication No.: US09859474B2Publication Date: 2018-01-02
- Inventor: Takayuki Kusunoki , Hiroyuki Iguchi
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch
- Priority: JP2015-163634 20150821
- Main IPC: C08G77/08
- IPC: C08G77/08 ; H01L33/50 ; H01L33/56 ; C08L83/16 ; C08G77/60 ; C08G77/12 ; C08G77/20

Abstract:
An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.
Public/Granted literature
- US20170051114A1 ADDITION CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND SEMICONDUCTOR PACKAGE Public/Granted day:2017-02-23
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