A light emitting device includes: a package equipped with a lead that has an upper surface and a lower surface, and has a metal board and a plating layer formed on a surface of the metal board, the plating layer including a first plating layer provided to an upper surface of the metal board, and a second plating layer provided to a lower surface of the metal board, the first plating layer including nickel plating layer, gold plating layer and silver plating layer, and the second plating layer including no nickel plating layer and gold plating layer, and a molded resin that holds the lead; a light emitting element mounted in the package; and a sealing member that seals the light emitting element.