Invention Grant
- Patent Title: Light emitting device, electronic appliance, and method for manufacturing light emitting device
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Application No.: US15353804Application Date: 2016-11-17
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Publication No.: US09859523B2Publication Date: 2018-01-02
- Inventor: Yoshiharu Hirakata , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2003-433025 20031226
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01L51/52 ; H01L27/32 ; H01L51/56 ; H01L33/52 ; H01L27/02 ; H01L51/50 ; H01L51/00

Abstract:
To provide a light emitting device that has a structure in which a light emitting element is sandwiched by two substrates to prevent moisture from penetrating into the light emitting element, and a method for manufacturing thereof. In addition, a gap between the two substrates can be controlled precisely. In the light emitting device according to the present invention, an airtight space surrounded by a sealing material with a closed pattern is kept under reduced pressure by attaching the pair of substrates under reduced pressure. A columnar or wall-shaped structure is formed between light emitting regions inside of the sealing material, in a region overlapping with the scaling material, or in a region outside of the scaling material so that the gap between the pair of substrates can be maintained precisely.
Public/Granted literature
- US20170069868A1 LIGHT EMITTING DEVICE, ELECTRONIC APPLIANCE, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2017-03-09
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