Invention Grant
- Patent Title: Connection assembly including an optical electronic part and a socket
-
Application No.: US15381106Application Date: 2016-12-16
-
Publication No.: US09859634B2Publication Date: 2018-01-02
- Inventor: Koichiro Ejiri , Haruhiko Kondo
- Applicant: SMK Corporation
- Applicant Address: JP Tokyo
- Assignee: SMK Corporation
- Current Assignee: SMK Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2016-101288 20160520
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R12/71 ; H01R12/73 ; H01R13/52

Abstract:
A connection assembly includes an optical electronic part and a socket. A conductive pad connected to a photoelectric conversion element of the optical electronic part is oriented with imaging field of view upward, and slidably contacts a contact of the socket. The optical electronic part includes an insulating case with a flange protruding along a horizontal plane, and a conductive pad that is exposed in an outer surface parallel to the horizontal plane. The socket includes a guide portion that slidably guides the flange portion along the horizontal plane, and a contact fixed to a housing opposed to the outer surface in which the conductive pad is exposed, with a contact portion located in a movement locus of the conductive pad sliding with the flange portion along the horizontal plane. As the insulating case is operated, the contact makes sliding contact with the conductive pad to provide a self-cleaning effect.
Public/Granted literature
- US20170338574A1 CONNECTION STRUCTURE BETWEEN OPTICAL ELECTRONIC PART AND SOCKET Public/Granted day:2017-11-23
Information query