The present invention aims to improve heat dissipation effect for an electrical component in a socket for electrical component in which a socket body and a cover member are separated. According to an embodiment, a cover member includes a frame-like cover body including an opening in a middle portion thereof, a heatsink provided to penetrate through the opening of the frame-like cover body, an elevating part supporting the heatsink, and a pressing part that is moveable to press the elevating part so as to press the heatsink against the electrical component. While the heatsink is pressed against the electrical component, the electrical component is fixed to the housing portion of the socket body. Accordingly, it is possible to make the heatsink perform heat dissipation for the electrical component. Thus, it is possible to obtain excellent heat dissipation effect with respect to the electrical component.