Invention Grant
- Patent Title: MEMS structure and method of forming same
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Application No.: US14745696Application Date: 2015-06-22
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Publication No.: US09859819B2Publication Date: 2018-01-02
- Inventor: Yi Heng Tsai , Chia-Hua Chu , Kuei-Sung Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H02N1/00
- IPC: H02N1/00 ; G01P15/125 ; B81B3/00 ; G01P15/08

Abstract:
A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.
Public/Granted literature
- US20150288297A1 MEMS Structure and Method of Forming Same Public/Granted day:2015-10-08
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