Invention Grant
- Patent Title: Shield can structure
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Application No.: US15356486Application Date: 2016-11-18
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Publication No.: US09860971B2Publication Date: 2018-01-02
- Inventor: Seung Bo Shim
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0161492 20151118
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K9/00 ; H05K1/02 ; H05K1/18 ; H04M1/02 ; H05K3/30

Abstract:
An electronic device includes a housing comprising a first plate, a second plate, and a side member, a printed circuit board arranged inside the housing and comprises a first surface, a second surface, and at least one side surface t, a first electronic component mounted on the first surface, a second electronic component mounted on the second surface, a first shield frame formed on the first surface and has a first opening, a second shield frame formed on the second surface and has a second opening, and a first shield cover comprising a first cover part and a first side part. The first cover part is supported by the first shield frame and covers the first electronic component. The first side part extends from the first cover part to the second shield frame and is covers the printed circuit board, the first opening, and a portion of the second opening.
Public/Granted literature
- US20170142823A1 SHIELD CAN STRUCTURE Public/Granted day:2017-05-18
Information query