Invention Grant
- Patent Title: Electrical connection interface for connecting electrical leads for high speed data transmission
-
Application No.: US14723662Application Date: 2015-05-28
-
Publication No.: US09860972B2Publication Date: 2018-01-02
- Inventor: Andrei Kaikkonen , Doron Lapidot , Lennart Lundqvist , Lars-Gote Svensson
- Applicant: FINISAR CORPORATION
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Priority: EP12194674 20121128
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H05K1/09 ; H05K1/11 ; H05K3/36 ; H05K1/03
Abstract:
An electrical connection interface is provided. The electrical connection interface includes a first ground plane layer, a second ground plane layer, a first substrate and a second substrate. The second ground plane layer is positioned to overlap the first ground plane layer. The first substrate includes a first substrate conductive lead with a first interface region connected to and electrically insulated from the first ground plane layer. The second substrate includes a second substrate conductive lead with a second interface region connected to the first substrate conductive lead and the second ground plane layer. The second substrate conductive lead is electrically insulated from the second ground plane layer.
Public/Granted literature
- US20150264803A1 Electrical Connection Interface For Connecting Electrical Leads For High Speed Data Transmission Public/Granted day:2015-09-17
Information query
