Invention Grant
- Patent Title: Via and trench filling using injection molded soldering
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Application No.: US15214942Application Date: 2016-07-20
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Publication No.: US09861313B1Publication Date: 2018-01-09
- Inventor: John U. Knickerbocker , Shriya Kumar , Jae-Woong Nah
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: H01L41/113
- IPC: H01L41/113 ; A61B5/00 ; B23K3/06 ; A61M5/00 ; B23K101/36
Abstract:
A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.
Public/Granted literature
- US20180000412A1 VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING Public/Granted day:2018-01-04
Information query
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