Invention Grant
- Patent Title: Processing apparatus and processing method
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Application No.: US14770015Application Date: 2013-11-22
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Publication No.: US09862055B2Publication Date: 2018-01-09
- Inventor: Saneyuki Goya , Masato Kinouchi , Minoru Danno , Toshiya Watanabe , Takashi Ishide , Tsugumaru Yamashita , Yoshihito Fujita , Makoto Yamasaki , Ryu Suzuki , Kohei Kanaoka
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-038008 20130227
- International Application: PCT/JP2013/081563 WO 20131122
- International Announcement: WO2014/132504 WO 20140904
- Main IPC: B23K26/064
- IPC: B23K26/064 ; B23K26/082 ; B23K26/21 ; B23K26/352 ; B23K26/36 ; B23K26/06 ; B23K26/38

Abstract:
A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.
Public/Granted literature
- US20160008920A1 PROCESSING APPARATUS AND PROCESSING METHOD Public/Granted day:2016-01-14
Information query
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