Invention Grant
- Patent Title: Systems and methods for substrate polishing end point detection using improved friction measurement
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Application No.: US13459071Application Date: 2012-04-27
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Publication No.: US09862070B2Publication Date: 2018-01-09
- Inventor: Shou-Sung Chang , Hung Chen , Lakshmanan Karuppiah , Paul D. Butterfield , Erik S. Rondum
- Applicant: Shou-Sung Chang , Hung Chen , Lakshmanan Karuppiah , Paul D. Butterfield , Erik S. Rondum
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: B24B49/00
- IPC: B24B49/00 ; B24B37/013 ; B24B49/16
Abstract:
Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.
Public/Granted literature
- US20130122782A1 SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT Public/Granted day:2013-05-16
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