Invention Grant
- Patent Title: Resin panel
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Application No.: US14358766Application Date: 2012-11-09
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Publication No.: US09862162B2Publication Date: 2018-01-09
- Inventor: Takehiko Sumi , Kiyotaka Kawai
- Applicant: KYORAKU CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: KYORAKU CO., LTD.
- Current Assignee: KYORAKU CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Maier & Maier, PLLC
- Priority: JP2011-256265 20111124; JP2012-042290 20120228; JP2012-076487 20120329
- International Application: PCT/JP2012/079097 WO 20121109
- International Announcement: WO2013/077198 WO 20130530
- Main IPC: B32B3/06
- IPC: B32B3/06 ; B32B27/08 ; B32B3/30 ; B29C49/20 ; B60R13/01 ; B32B37/00 ; B29C49/00 ; B29C49/04 ; B29C49/42

Abstract:
A resin panel of which contact surfaces of a rear wall to be in contact with another member are made unlikely to deform while reducing the weight of the resin panel. The panel includes a rear wall having a plurality of contact surfaces to be in contact with another member, and a front wall opposing the rear wall with an interval therebetween, the resin panel including a plurality of ribs obtained by indenting parts of the rear wall toward the front wall and welding the parts to an inner surface of the front wall, wherein a wall thickness of the front wall is generally equal to or smaller than a wall thickness of the rear wall.
Public/Granted literature
- US20150086759A1 RESIN PANEL AND FORMING METHOD Public/Granted day:2015-03-26
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