Invention Grant
- Patent Title: Electrically conductive adhesive composition, connection structure, solar battery module, and method for producing same
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Application No.: US14640493Application Date: 2015-03-06
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Publication No.: US09862866B2Publication Date: 2018-01-09
- Inventor: Shinichirou Sukata
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JP2014-046744 20140310
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/18 ; C09J163/00 ; H01L31/048 ; C09J9/02 ; C08G59/68 ; H01L31/0224 ; H01L31/05
Abstract:
An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.
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