Invention Grant
- Patent Title: Thermally-conductive polycarbonate resin composition and molded product formed therefrom
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Application No.: US14912963Application Date: 2013-12-02
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Publication No.: US09862870B2Publication Date: 2018-01-09
- Inventor: Nam Hyun Kim , Chan Gyun Shin , Byung Kuk Jeon , Jong Cheol Lim
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yeosu-si
- Assignee: Lotte Advanced Materials Co., Ltd.
- Current Assignee: Lotte Advanced Materials Co., Ltd.
- Current Assignee Address: KR Yeosu-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2013-0100100 20130823
- International Application: PCT/KR2013/011065 WO 20131202
- International Announcement: WO2015/026014 WO 20150226
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08L69/00 ; C08L23/26
Abstract:
The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
Public/Granted literature
- US20160200957A1 Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom Public/Granted day:2016-07-14
Information query
