Invention Grant
- Patent Title: Cooling device for under-floor device for vehicle
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Application No.: US14361519Application Date: 2012-11-22
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Publication No.: US09863302B2Publication Date: 2018-01-09
- Inventor: Hiroyuki Higashino , Yukio Nakashima , Shigetoshi Ipposhi
- Applicant: Hiroyuki Higashino , Yukio Nakashima , Shigetoshi Ipposhi
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-270023 20111209
- International Application: PCT/JP2012/080368 WO 20121122
- International Announcement: WO2013/084729 WO 20130613
- Main IPC: B60H3/00
- IPC: B60H3/00 ; F01P1/06 ; B61C17/00 ; H05K7/20

Abstract:
A cooling device includes a base plate to a rear surface side of which an under-floor device is attached. A heat radiating unit is attached to a front surface side of the base plate and radiating heat is conducted from the under-floor device via the base plate. A cover surrounding the heat radiating unit and including a side opening is capable of causing traveling wind to flow therein and thereout, in opposite side surfaces facing a traveling direction of a vehicle. A guide plate guides traveling wind flowing in from the side opening to the heat radiating unit by blocking at least part of a gap area between a surface connecting the opposite side surfaces and the heat radiating unit, the guide plate being provided in a side gap area between a side surface of the cover and the heat radiating unit on a traveling-wind flow-in side.
Public/Granted literature
- US20140318736A1 COOLING DEVICE FOR UNDER-FLOOR DEVICE FOR VEHICLE Public/Granted day:2014-10-30
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