Invention Grant
- Patent Title: Wafer alignment mark scheme
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Application No.: US14486514Application Date: 2014-09-15
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Publication No.: US09863754B2Publication Date: 2018-01-09
- Inventor: Wei-Hsiang Tseng , Chin-Hsiang Lin , Heng-Hsin Liu , Jui-Chun Peng , Ho-Ping Cheng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G01B11/02 ; G03F9/00 ; H01L23/544

Abstract:
A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.
Public/Granted literature
- US20150002846A1 WAFER ALIGNMENT MARK SCHEME Public/Granted day:2015-01-01
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