Invention Grant
- Patent Title: Interconnection evaluation system and method for switchboard
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Application No.: US14663178Application Date: 2015-03-19
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Publication No.: US09864010B2Publication Date: 2018-01-09
- Inventor: Woo Seok Lee , Yong Gee Cho
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si
- Agency: Lee, Hong, Degerman, Kang & Waimey
- Priority: KR10-2014-0037845 20140331
- Main IPC: G01R31/04
- IPC: G01R31/04 ; G01R31/327 ; G01R31/02 ; G01R31/28 ; H04M5/06 ; H04M3/28

Abstract:
An interconnection evaluation system according to the present disclosure includes a switchboard including at least one endpoint, at least one endpoint contact tester configured to transmit a digital input signal obtained from each endpoint, an automation tester configured to output a preset digital output signal to the switchboard, and to generate interconnection information at each endpoint by reflecting the digital output signal and digital input signal, and an interface unit configured to generate a switchboard status information of switchboard by reflecting the interconnection information.
Public/Granted literature
- US20150276878A1 INTERCONNECTION EVALUATION SYSTEM AND METHOD FOR SWITCHBOARD Public/Granted day:2015-10-01
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