A contact hole that penetrates a protective insulating film, an interlayer insulating film, and a transparent cap film and has a surface of a low-reflection film uncovered as a bottom surface is formed in a lead-out wiring region. A lower-layer terminal portion is formed by the low-reflection film and a low-resistance conductive film below the bottom surface of the contact hole. A contact hole that penetrates the protective insulating film and a transparent cap film and has a surface of a low-reflection film uncovered as a bottom surface is formed in the lead-out wiring region. An upper-layer terminal portion is formed by the low-reflection film and a low-resistance conductive film below the bottom surface of the contact hole.