Invention Grant
- Patent Title: Wiring thin plate with a wiring part and a protrusion having the same height, flexure as the wiring thin plate and method of welding of the wiring thin plate
-
Application No.: US15168907Application Date: 2016-05-31
-
Publication No.: US09865285B2Publication Date: 2018-01-09
- Inventor: Naoki Tanaka
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Norris McLaughlin & Marcus P.A.
- Priority: JP2015-108982 20150528
- Main IPC: G11B5/48
- IPC: G11B5/48 ; B23K26/22 ; B23K26/32 ; B23K101/36
Abstract:
Provided is a wiring thin plate capable of securely hold-down the wiring thin plate around a scheduled portion to be a welded spot even if the wiring thin plate is downsized and involves widened wiring traces. The wiring thin plate includes a metal supporting layer, an insulating layer on the supporting layer, a wiring part having a plurality of wiring traces on the insulating layer, a scheduled portion defined on the supporting layer to be welded, and a protrusion formed on the supporting layer for the scheduled portion and having a height that is the same as a height of the wiring part.
Public/Granted literature
Information query
IPC分类:
