A magnetic tape recording module having electrical lapping guides located within and adjacent to an array of magnetic read/write elements. Electrical leads connected with the electrical lapping guides are buried deep within the head build, close to the substrate so that they can pass beneath the electrical leads of the read/write elements without any capacitive coupling between the electrical lapping guide leads and the read/write element leads. The presence of the electrical lapping guides within and adjacent to the read/write element leads provides much more accurate control of read/write element stripe height during lapping.