Invention Grant
- Patent Title: Backside polisher with dry frontside design and method using the same
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Application No.: US15052310Application Date: 2016-02-24
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Publication No.: US09865477B2Publication Date: 2018-01-09
- Inventor: Chih-Hung Chen , Chia-Jung Hsu , Yi-An Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L21/02 ; H01L21/683 ; H01L21/673
Abstract:
The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a wafer stage that is operable to secure and rotate a wafer; a polish head configured to polish a backside surface of the wafer; an air bearing module configured to apply an air pressure to a front surface of the wafer; and an edge sealing unit configured to seal edges of the wafer.
Public/Granted literature
- US20170243733A1 Backside Polisher with Dry Frontside Design and Method Using the Same Public/Granted day:2017-08-24
Information query
IPC分类:
