Invention Grant
- Patent Title: Receiving device for handling structured substrates
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Application No.: US14758675Application Date: 2014-01-07
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Publication No.: US09865492B2Publication Date: 2018-01-09
- Inventor: Herbert Tiefenbock
- Applicant: EV GROUP E. THALLNER GMBH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Priority: DE102013100563 20130121
- International Application: PCT/EP2014/050121 WO 20140107
- International Announcement: WO2014/111288 WO 20140724
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H01L21/683 ; H01L21/687
Abstract:
A mounting apparatus for handling of a structured substrate which has structures. The mounting apparatus having a soft material layer for accommodating the structured substrate on a receiving surface. The structures of the structured substrate are able to be taken at least partially into the material layer. Fixing means for fixing of the structured substrate on the receiving surface are provided.
Public/Granted literature
- US20150357227A1 RECEIVING DEVICE FOR HANDLING STRUCTURED SUBSTRATES Public/Granted day:2015-12-10
Information query
