Invention Grant
- Patent Title: Tunable semiconductor band gap reduction by strained sidewall passivation
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Application No.: US14821271Application Date: 2015-08-07
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Publication No.: US09865520B2Publication Date: 2018-01-09
- Inventor: Christopher Heidelberger , Jeehwan Kim , Ning Li , Wencong Liu , Devendra K. Sadana
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Louis J. Percello
- Main IPC: H01S5/22
- IPC: H01S5/22 ; H01L23/31 ; H01S5/028 ; H01L29/06

Abstract:
A semiconductor device includes a mesa structure having vertical sidewalls, the mesa structure including an active area comprising a portion of its height. A stressed passivation liner is formed on the vertical sidewalls of the mesa structure and over the portion of the active area. The stressed passivation liner induces strain in the active area to permit tuning of performance parameters of the mesa structure.
Public/Granted literature
- US20170040240A1 TUNABLE SEMICONDUCTOR BAND GAP REDUCTION BY STRAINED SIDEWALL PASSIVATION Public/Granted day:2017-02-09
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