Invention Grant
- Patent Title: Methods of forming wire interconnect structures
-
Application No.: US15298406Application Date: 2016-10-20
-
Publication No.: US09865560B2Publication Date: 2018-01-09
- Inventor: Thomas J. Colosimo, Jr. , Jon W. Brunner
- Applicant: Kulicke and Soffa Industries, Inc.
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agency: Stradley Ronon Stevens & Young, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00
Abstract:
A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
Public/Granted literature
- US20170040280A1 METHODS OF FORMING WIRE INTERCONNECT STRUCTURES Public/Granted day:2017-02-09
Information query
IPC分类:
