Invention Grant
- Patent Title: Electronic package having a supporting board and package carrier thereof
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Application No.: US15424878Application Date: 2017-02-05
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Publication No.: US09865561B2Publication Date: 2018-01-09
- Inventor: En-Min Jow , Cheng-Yu Kang
- Applicant: ADL ENGINEERING INC.
- Applicant Address: TW Hsin-Chu
- Assignee: ADL ENGINEERING INC.
- Current Assignee: ADL ENGINEERING INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Chieh-Mei Wang
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H05K1/11 ; H01L23/14 ; H01L23/498 ; H01L21/56 ; H01L21/48
Abstract:
A package carrier is provided. The package carrier includes a wiring layer and an insulating pattern. The wiring layer includes at least one connecting pad and at least one mounting pad. The mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component. The insulating pattern is stacked on and connected to the wiring layer. A boundary surface is formed between the wiring layer and the insulating pattern. Both of the wiring layer and the insulating pattern do not extend over the boundary surface. In addition, an electronic package including the package carrier is also provided.
Public/Granted literature
- US20170170138A1 ELECTRONIC PACKAGE AND PACKAGE CARRIER Public/Granted day:2017-06-15
Information query
IPC分类:
