Invention Grant
- Patent Title: Semiconductor device and method for testing the semiconductor device
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Application No.: US15041027Application Date: 2016-02-10
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Publication No.: US09865586B2Publication Date: 2018-01-09
- Inventor: Hideaki Katakura , Yoshiaki Toyoda
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Rabin & Berdo, P.C.
- Priority: JP2015-054604 20150318
- Main IPC: H01L27/02
- IPC: H01L27/02 ; G01R31/26 ; H01L29/735

Abstract:
A semiconductor device and a method for testing the semiconductor device are provided. The semiconductor device includes a diode (protection element) and a semiconductor element having a withstand voltage that is higher than that of the diode provided on one and the same first-conductive-type semiconductor substrate, the diode having a second-conductive-type first semiconductor region selectively provided in a front surface layer of the semiconductor substrate. A high concentration region is open in a normal time, but is short-circuited to a potential higher than that of a GND pad through a second wiring layer in a screening test time. Thus, a semiconductor device and a method for testing the semiconductor device are provided, in which a protection element can be prevented from breaking down and initial failure of a device which is formed on one and the same semiconductor substrate as the protection element can be detected accurately.
Public/Granted literature
- US20160276333A1 SEMICONDUCTOR DEVICE AND METHOD FOR TESTING THE SEMICONDUCTOR DEVICE Public/Granted day:2016-09-22
Information query
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